LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope Extremely low noise and space

Extremely low noise and space saving design

the lead-free soldering iron tip has fast heat conduction

OCA Lamination And Screen Alignment 2 In 1 Mold for iPhone X/XS

Multiple combination modules

Gross Weight: 55kg

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope Extremely low noise and spaceLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient